The CMI153 features dual measurement technology that automatically detects either ferrous or non-ferrous substrates and t…
The CMI165 provides unique temperature compensated Copper thickness measurements in an ergonomic hand-held device.
The CMI233 package enables control of plating and paint & powder coating processes using advanced magnetic induction and …
CMI243 measures coating thickness measurement for conductive coatings over conductive substrates.
The CMI243 package ena…
Dual technology features magnetic induction and Eddy Current measurement techniques with statistical analysis and PC inte…
Oxford Instruments CMI511 is a temperature compensating gauge for measuring Plated Through Hole (PTH) Cu thickness using …
Oxford Instruments CMI563 measures surface copper thickness applications to serve the quality control needs of the Printe…
The CMI730 package enables control of plating / coating processes using advanced magnetic induction and eddy-current tech…
The CMI760 and CMI760N packages measures surface copper thickness applications to serve the quality control needs of the …
The CMI760 and CMI760N packages measures surface copper thickness applications to serve the quality control needs of the …
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