CMI760N涂层测厚仪

The CMI760 and CMI760N packages measures surface copper thickness applications to serve the quality control needs of the Printed Circuit Board industry.

The CMI760 and CMI760N packages measures surface copper thickness applications to serve the quality control needs of the Printed Circuit Board industry.  The package consists of a CPU unit, a probe and NIST traceable calibration standards.  The probe utilizes Oxford Instruments proprietary SRP-4 microresistance technology featuring user-replaceable measurement tips for the standard (CMI760, SRP-4) or narrow (CMI760N, SRP-4N) varieties.