执行标准： GB/T9286-88 . GB/T13452.2 - 92 . GB/T9275-88 本仪器集划格附着力、漆膜厚度和巴克霍尔兹压痕硬度三项试验功能于一体，适用于漆膜划格附着力、漆膜厚度和巴克霍尔兹压痕试验。
The CMI233 package enables control of plating and paint & powder coating processes using advanced magnetic induction and eddy-current technology.
CMI243 measures coating thickness measurement for conductive coatings over conductive substrates.
The CMI243 package enables control of plating coating processes using advanced eddy-current technology. It provides non-de…
Dual technology features magnetic induction and Eddy Current measurement techniques with statistical analysis and PC interface. The CMI250 is a feature rich instrument built upon our established Eddy Current / Magnetic In…
Oxford Instruments CMI511 is a temperature compensating gauge for measuring Plated Through Hole (PTH) Cu thickness using Eddy Current technology. The CMI511 system is a hand held。
Oxford Instruments measures surface copper thickness applications to serve the quality control needs of the Printed Circuit Board industry.
package enables control of plating / coating processes using advanced magnetic induction and eddy-current technology. The CMI730 provides non-destructive coating / plating thickness measurement for non-magnetic coatings …
packages measures surface copper thickness applications to serve the quality control needs of the Printed Circuit Board industry.
执行标准： GB/T1764-89 、GB/T13452.2-92 、ISO2808-74 ，本仪器适于测定磁性材料表面上非磁性涂镀层的厚度。专用于铁磁性材料表面上非磁性涂镀层厚度的测定。
and CMI760EN for Cu thickness measurements. The CMI760E and CMI760EN packages measures surface Cu thickness and plated through hole (PTH) Cu thickness applications to serve the quality control
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