CMI760ENCMI760EN涂层测厚仪

and CMI760EN for Cu thickness measurements. The CMI760E and CMI760EN packages measures surface Cu thickness and plated through hole (PTH) Cu thickness applications to serve the quality control needs of the Printed Circuit Board (PCB) industry.

The CMI 760E and CMI760EN packages measures surface Cu thickness and plated through hole (PTH) Cu thickness applications to serve the quality control needs of the Printed Circuit Board (PCB) industry.  The package consists of a CPU unit, two distinctly different probes and NIST traceable calibration standards. 
The surface Cu probe utilizes Oxford Instruments proprietary SRP-4 microresistance technology featuring user-replaceable measurement tips for the standard (CMI760, SRP-4) and narrow (CMI760N, SRP-4N) varieties.

The PTH Cu thickness probe, the ETP, utilizes eddy-current technology to measure Cu thickness on the walls of plated vias or plated through holes on PCBs.  Additionally the TRP Measurement Module with fixed XY stage can be added for microresistance measurements of Cu thickness and quality in plated through holes.