Oxford Instruments CMI563 measures surface copper thickness applications to serve the quality control needs of the Printed Circuit Board industry. 

The package consists of a versatile hand-held unit equipped with a carry case for protection and portability, a measurement probe, and NIST traceable calibration standards.  The probe utilizes Oxford Instruments proprietary SRP-4 microresistance technology featuring economical, user-replaceable measurement tips.

Measure the thickness of copper foil on rigid, flexible, single- and double-sided, or multi-layer PCBs

Measure foil or laminated copper thickness in mils or µm

Sort copper by weight at incoming inspection, before drilling, shearing or plating

Determine electroless or electroplated Cu thickness on PCBs

Accurately quantify copper thickness after etching or planarizing

Verify copper plating thickness on PCB surface

Rugged hand-held 16-button unit featuring a large 4-digit LCD display

Features Oxford Instruments proprietary, economical, user-replaceable SRP-4 probe tips that can be easily replaced on site minimizing downtime   

Contains fine-line measurement algorithm for measuring on Cu traces

RS-232 serial port output for a printer or PC download

Statistical data analysis and reporting with memory location, number of readings, Cu type, date-time stamping, mean, standard deviation, accuracy, high, low, range, cpk, and histogram